Engineered for precision and speed, the T3SP15D redefines how you measure
signal integrity on PCBs and cables. With calibrated differential TDRs, it
delivers ultra-fast, high-resolution characteristic impedance profile
analysis, both single-ended and differential. Lightweight, compact, and
battery-powered (optional), the T3SP15D fits into any environment: lab,
quality control, production, or field.
True Differential and Calibrated TDR for Maximum Impedance
Measurement Accuracy
Compact, Battery-Powered Design for true portability
30 ps Typical Rise Time, S-Parameter support up to
15 GHz
50,000-point memory for DUTs up to 50 meters (XR
models)
Automatic Ohmic Loss Compensation for enhanced accuracy
Built-in Skew Analysis (Inter-Pair and Intra-Pair) for
differential signal integrity
XR Series: Engineered for Speed, Optimized for Continuous
Cable Production
True-Differential TDRs
Most of the modern high-speed designs are implemented with
differential transmission lines. Using a true differential TDR simplifies the setup
for signal integrity measurements in such designs. In some scenarios the ground
connection could be difficult to connect or not accessible if you want measure
unshielded twisted pair cables. Most of the time, when you take measurements using a
true differential TDR a ground connection is not required and gives you the
flexibility to use TDR-probes without a ground connection.
Fast TDR Repetition Rate
With up to 10 MHz repetition
rate the T3SP-series is more than 300 times faster as conventional TDR instruments
which are based on sampling scopes. To achieve the highest possible dynamic range
TDR instruments need to acquire and average out hundreds of waveforms. The faster
sampling rate delivers quicker and more accurate measurement results.
T3SP15-XR models for cable manufacturers
The T3SP15D-XR was created to provide a better alternative
to production than using obsolete TDRs based on the sampling oscilloscope platform.
Four new time bases were added into T3SP15D-XR, achieving two results. First, the
extension of measurements to cables up to 50 m, and second, the ability to make very
fast acquisitions, which is a key requirement for production. We added a repetition
rate of 500 KHz, suitable for longer cables, and sampling rates of 20 ps and 40 ps,
suitable for ultrafast acquisition times.
Full Calibrated Impedance Plot
Reference impedance in all TDR
instruments are relative; they are made by comparing reflected amplitudes to an
incident amplitude. Using full OSLT-calibration the T3SP-series is offering best
accuracy for impedance measurements in time and frequency domain. Using four
calibration standards (open, short, load, thru) for T3SP15D in the time domain
instead of using a simple normalization which is common in TDR-instruments offers
vastly improved error correction for the setup. Using OSLT calibration in the time
domain avoids irregularities in impedance plots, such as ringing that occurs after
the TDR incident step.
Full calibrated S-Parameter
Many of the modern standards
like Ethernet or USB require you to measure the impedance matching of the cables and
connectors within the frequency domain. These are the measures commonly made with
traditional VNA instruments. The T3SPseries offers fully calibrated differential
S-Parameter measurements up to 15 GHz (T3SP15D) using the same OSLT-calibration
standards used by VNAs.
Trust, But Test—Your Cables Might Be
Lying
Even premium cables can hide
imperfections that introduce measurement artifacts. The T3SP Series instantly
reveals cable quality, pinpointing out-of-spec sections caused by damage or defects.
With up to 50,000-point acquisition, the SP Series delivers long, high-resolution
TDR captures—ideal for extended DUTs. Flexible repetition rates from 10 MHz to 1 MHz
support cable lengths up to 30 meters, while XR models extend this range to 50
meters with rates down to 500 kHz.
ESD-protection
High-frequency measurement devices are extremely sensitive
to electrostatic discharge (ESD) and can lead to permanent damage to your
measurement device. In addition, many laboratories have a requirement to take
special precautions to protect their electronic equipment from any damage caused by
ESD. The SP-series mitigates this risk by providing a higher degree of protection
from this happening. Every SP-series model comes equipped with an ESD-protection
module based on high-performance coaxial RF-switches. The ways this works is the RF
input circuitry is protected by isolating the devices RF-signal detector from the
input connector when the device is not being used to take measurements.
S-Parameter Measurements
The high bit rates used in modern electronics design and
future serial data standards extend well into the microwave region. For example, the
High-speed Universal Serial Bus (USB3.1) supports transfer rates up to 10 GB/s over
twisted-pair cables. These high bit rate transmissions through connectors and cables
results in considerable distortion because of channel dispersion. To keep the
distortion to manageable levels, many standards specify the impedance, return loss
and insertion loss for cables and connectors. These measurements are represented by
the S-parameter. The T3SP series offer fully calibrated differential S-Parameter
measurements up to 15 GHz (T3SP15D). This gives you the flexibility to store your
output files in a variety of formats (CSV, Matlab and Touchstone) which can be
easily which can be easily used in tools like SI-Studio, Matlab or other simulation
programs.
Impedance Traces on PCBs
Due to increasing clock rates in high speed digital systems
the necessity of controlled impedance Printed Circuit Boards (PCBs) is growing
rapidly. Additionally, cables and connectors must meet high frequency design
specifications and controlled impedance specifications. The T3SP-series helps you to
measure wave impedances of PCBs, cables, and connectors very accurate and
comfortably. In contrast to other systems on the market, the T3SP-series is designed
for measuring specific traces on a PCB and for on-board tests, the TDR-Probes ensure
accurate measurement for qualification testing and debugging assembled PCBs.
In this webinar, you will learn how to interpret a TDR’s measured
instantaneous impedance profile in terms of the interconnect’s
characteristic impedance and time delay, and the location of
impedance discontinuities.
In this webinar, Dr. Eric Bogatin will explore how to think about
differential and common impedance. Based on the properties of a
differential pair, we will look at using a two port TDR as a
differential TDR so we can characterize the basic differential
impedance properties of the interconnect.
In this webinar, Dr. Eric Bogatin explores how unshielded twisted
pair (UTP) cables have no adjacent return plane yet can make great
differential interconnects.
In this webinar, Dr. Eric Bogatin shows you how to analyze
interconnects that are not uniform transmission lines. What does
it mean to characterize a discontinuity? He will introduce you to
the exciting and fun technique of “hacking interconnects” which
anyone can do using a free and open source simulation tool which
is provided.
A TDR can measure much more than just the impedance profile of a
transmission line. In this webinar, Dr. Eric Bogatin introduce you
to a more advanced instrument to meet your most demanding needs.