The Effects of Passive Probe Ground Leads
This article explains how the inductance of passive probe ground leads can dramatically reduce effective bandwidth, distort measurements, and introduce resonance and frequency-response errors.
Foundational and advanced concepts for maintaining clean, reliable signals in high-speed designs. Covers measurement techniques, common pitfalls, and practical approaches to identifying and mitigating signal degradation in order to maintain signal integrity and power integrity in electrical designs.
Ground bounce occurs when simultaneous switching currents flow through shared inductance in IC packages, creating voltage noise that can lead to digital bit errors.
Quiet-low and quiet-high I/O drivers can act as on-die sense lines, helping engineers observe and analyze ground bounce in digital systems.
Ground bounce occurs when multiple switching signals share a high-inductance return path, creating voltage noise that can disrupt digital I/O performance.
Choosing between a 50 Ω and 1 MΩ oscilloscope input depends on signal bandwidth, cable impedance, and voltage level to ensure accurate and safe measurements.
Characterizing PDN noise—whether from self-aggression, board coupling, or mutual aggressors—is essential to maintaining millivolt-level power integrity margins.
Board pollution noise arises when switching activity and VRM ripple couple onto PCB power planes, and spectral analysis can reveal the dominant aggressors.
Self-aggression noise arises from a device’s own switching activity, creating ripple and rail disturbances even in otherwise steady-state conditions.
Characterizing rail transient response and mutual aggressor noise helps quantify droop, ripple, and recovery behavior in power delivery networks.
Understanding your lab’s RF background with spectral analysis and near-field probing helps separate real device emissions from environmental noise.
Near-field measurements capture all radiation components close to a device, but only dipole terms dominate far-field EMC compliance results.
Time-domain near-field probing reveals radiated emission signatures synchronized with switching currents, helping pinpoint return path discontinuities before EMC testing.
Small amounts of common current from ground bounce and return path gaps can turn ordinary interconnects into efficient radiating antennas.